- Homray Material Technology
-
Suzhou, Jiangsu, China
- Main products: GaN Substrate Manufacturers, GaN Wafer Suppliers, GaN-On-Sapphire Wafer Manufacturers, SiC Substrate Manufacturers, SiC Wafer Suppliers, GaN-On-Si Epi Wafer Suppliers, GaN-On-SiC Epi Wafer Suppliers, GaN-On-Silicon Epi Wafer Suppliers
Home > Products > Silicon Carbide Wafer > SiC Wafer 930um Thickness Manufacturer No Lapping no Polishing
SiC Wafer 930um Thickness Manufacturer No Lapping no Polishing
Negotiable
/ Piece
10 Pieces(Min. Order)
- SHANGHAI
- T/T
- 30 days
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Product Details
| Brand Name | HMT | Place of Origin | China | |
| Model Number | 6inch |
Product Description
SiC Wafer 930um Thickness Manufacturer No lapping no polishing
Are you looking for thickest SiC Substrate wafer? come and have a look at HMT Unpolished SiC wafer with 400um 600um and 930um thickness for your select. As-cut SiC wafer can be used for diamond wheel grinding, lapping and polishing testing.
Some SiC substrate manufacturers use grinding wheel thinning, the current commonly used grinding wheel is 2000# coarse grinding, 8000# fine grinding. The process scheme has the advantages of flexible processing, high stability and simple process. However, since the wafer is in vacuum during the thinning process, it is not conducive to the repair of Bow/Warp. In addition, the wear ratio of domestic grinding wheel is large, the processing cost is high, and more rely on imports.
Contact Us
- Homray Material Technology
- Contact nameTina Chang Chat Now
- Phone86-512-67078567
- Address60 Suli Road, Suzhou, Jiangsu
Product Categories
| Silicon Wafer | Silicon Carbide Wafer | Gallium Nitride |
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